Electro-optical device, manufacturing method of electro-optical device, and electronic apparatus

ABSTRACT

An electro-optical device includes a first substrate, a second substrate, and a color filter disposed in a layer between the first substrate and the second substrate. An adhesive is disposed in a layer between the color filter and the second substrate. A first overcoat layer is disposed in a layer between the adhesive and the color filter, and a second overcoat layer is disposed in the layer between the adhesive and the color filter and is disposed along the first overcoat layer.

This is a continuation application of U.S. patent application Ser. No.16/288,764 filed on Feb. 28, 2019, which claims priority to JapanesePatent Application No. 2018-036220 filed on Mar. 1, 2018. Entirecontents of each of the identified applications are hereby incorporatedby reference.

BACKGROUND 1. Technical Field

The present invention relates to an electro-optical device, amanufacturing method of an electro-optical device, and an electronicapparatus.

2. Related Art

Organic electro-luminescence (EL) devices that include organic ELelements in pixels are known as electro-optical devices. Because organicEL elements can be made smaller and thinner than light-emitting diodes(LEDs), the use of organic EL elements in microdisplays such ashead-mounted displays (HMDs) and electronic viewfinders (EVFs) isgarnering attention.

For example, JP-A-2014-89804 proposes an organic EL device combiningorganic EL elements that emit white light with a color filter as meansfor realizing a color display in such a microdisplay. In the organic ELdevice of JP-A-2014-89804, a sealing layer is formed covering aplurality of organic EL elements disposed on a substrate, and a colorfilter constituted by blue (B), green (G), and red (R) coloring layersis formed on the sealing layer. The coloring layers that constitute thecolor filter are partitioned by protrusions on the sealing layer whichare lower in height than the coloring layers. Compared to aconfiguration lacking such protrusions, the organic EL device ofJP-A-2014-89804 reduces the percentage of emitted light from the organicEL element that, at the boundaries between the coloring layers, passesthrough coloring layers of colors aside from the coloring layer throughwhich that light is originally supposed to pass. This is said to becapable of realizing excellent symmetry with respect to the visual fieldangle characteristics.

In the organic EL device disclosed in JP-A-2014-89804, an opposingsubstrate is arranged opposite the element substrate on which theorganic EL elements and color filter are formed, with a transparentresin layer interposed between the element substrate and the opposingsubstrate, to protect the color filter. In other words, the organic ELdevice is configured by affixing the element substrate and the opposingsubstrate to each other with interposing the transparent resin layer.

However, if, for example, the thicknesses of the coloring layers arethen adjusted to vary on a color-by-color basis to achieve desiredoptical characteristics, level differences will arise between thecoloring layers. In such a case, there is a risk, when affixing theelement substrate and the opposing substrate to each other, that theresin material will be unevenly applied when forming the transparentresin layer that covers the color filter of the element substrate, thatbubbles will form at the areas of level differences between the coloringlayers, or the like. Bubbles in particular will affect the display, andthere is thus a need for improvement.

SUMMARY

An electro-optical device according to an aspect of the inventionincludes, a first substrate including a plurality of light-emittingelements and a color filter provided corresponding to the plurality oflight-emitting elements, and a second substrate being alight-transmissive substrate and disposed facing the first substratewith an adhesive provided between the first substrate and the secondsubstrate, wherein an adhesive surface of the color filter of the firstsubstrate is provided with protrusions and recesses in a stripe pattern.

Preferably, the above-described electro-optical device includes anovercoat layer provided on the color filter, the overcoat layer being alight-transmissive layer, and the protrusions and recesses in stripesare provided in the overcoat layer.

Preferably, in the above-described electro-optical device, the colorfilter includes coloring layers of at least three colors, and theovercoat layer covers a coloring layer arranged in a first directionamong the coloring layers of at least three colors.

Additionally, in the above-described electro-optical device, thecoloring layer arranged in the first direction may include coloringlayers having different thicknesses.

Additionally, in the above-described electro-optical device, a coloringlayer arranged in a second direction intersecting with the firstdirection may have a thickness different from that of the coloring layerarranged in the first direction.

Preferably, in the above-described electro-optical device, the overcoatlayer includes a first overcoat layer covering the color filter, and asecond overcoat layer extending in a first direction on the firstovercoat layer, and the protrusions and recesses in a stripe pattern areformed by the first overcoat layer and the second overcoat layer.

Additionally, in the above-described electro-optical device, the colorfilter may include coloring layers of at least three colors, and theprotrusions and recesses in a stripe pattern may be formed by makingthicknesses of two coloring layers of different colors, among thecoloring layers of at least three colors, different from each other.

Preferably, in the above-described electro-optical device, the colorfilter includes coloring layers of at least three colors, and alight-shielding portion formed by laminating the coloring layers of atleast three colors is provided in a position surrounding alight-emitting region in which the plurality of light-emitting elementsare disposed.

A method of manufacturing an electro-optical device according to anaspect of the invention is a method of manufacturing an electro-opticaldevice including a plurality of light-emitting elements and a colorfilter, the method including, forming a sealing layer sealing theplurality of light-emitting elements across a light-emitting region of afirst substrate, the light-emitting region being a region in which theplurality of light-emitting elements are disposed, forming a colorfilter by forming coloring layers of at least three colors on thesealing layer, the coloring layers corresponding to the plurality oflight-emitting elements, forming an overcoat layer covering a coloringlayer arranged in a first direction among the coloring layers of atleast three colors, the overcoat layer being a light-transmissive layer,and affixing the first substrate provided with the first substrate to asecond substrate using an adhesive, the second substrate being alight-transmissive substrate.

A method of manufacturing an electro-optical device according to anotheraspect of the invention is a method of manufacturing an electro-opticaldevice including a plurality of light-emitting elements and a colorfilter, the method including, forming a sealing layer sealing theplurality of light-emitting elements across a light-emitting region of afirst substrate, the light-emitting region being a region in which theplurality of light-emitting elements are disposed, forming a colorfilter by forming coloring layers of at least three colors on thesealing layer, the coloring layers corresponding to the plurality oflight-emitting elements, forming a first overcoat layer covering thecolor filter, with the first overcoat layer being a light-transmissivelayer, and forming a second overcoat layer extending in the firstdirection on the first overcoat layer, with the second overcoat layerbeing a light-transmissive layer, and affixing the first substrateprovided with the first overcoat layer and the second overcoat layer, toa second substrate using an adhesive, the second substrate being alight-transmissive substrate.

A method of manufacturing an electro-optical device according to anotheraspect of the invention is a method of manufacturing an electro-opticaldevice including a plurality of light-emitting elements and a colorfilter, the method including, forming a sealing layer sealing theplurality of light-emitting elements across a light-emitting region of afirst substrate, the light-emitting region being a region in which theplurality of light-emitting elements are disposed, forming a colorfilter by forming coloring layers of at least three colors on thesealing layer, the coloring layers corresponding to the plurality oflight-emitting elements, and affixing the first substrate provided withthe color filter to a second substrate using an adhesive, the secondsubstrate being a light-transmissive substrate, wherein in the formingof the color filter, a first coloring layer and a second coloring layer,among the coloring layers of at least three colors, are formed to bearranged in a first direction, and a third coloring layer having adifferent thickness from the first coloring layer and the secondcoloring layer is formed and arranged adjacent to the first coloringlayer and the second coloring layer in a second direction intersectingwith the first direction.

Preferably, in the above-described method of manufacturing anelectro-optical device, in the forming of the color filter, alight-shielding portion is formed by laminating the coloring layers ofat least three colors in a position surrounding the light-emittingregion.

Preferably, in the above-described method of manufacturing anelectro-optical device, in the forming of the color filter, alight-shielding portion is formed by laminating the coloring layers ofat least three colors in a position surrounding the light-emittingregion, and in the forming of the overcoat layer, the overcoat layer isformed on an inner side of the light-shielding portion.

An electronic apparatus according to an aspect of the invention includesthe above-described electro-optical device.

BRIEF DESCRIPTION OF THE DRAWINGS

The invention will be described with reference to the accompanyingdrawings, wherein like numbers reference like elements.

FIG. 1 is a plan view schematically illustrating the configuration of anelectro-optical device according to a first exemplary embodiment.

FIG. 2 is an equivalent circuit diagram illustrating the electricalconfiguration of the electro-optical device according to the firstexemplary embodiment.

FIG. 3 is a plan view schematically illustrating the arrangement of subpixels and a color filter in a pixel.

FIG. 4 is a schematic cross-sectional view illustrating the structure ofa sub pixel, taken along line A-A□ from FIG. 3.

FIG. 5 is a plan view schematically illustrating the arrangement of alight-shielding portion in an element substrate.

FIG. 6 is a schematic cross-sectional view illustrating the structure ofthe electro-optical device, taken along line C-C□ from FIG. 5.

FIG. 7 is a flowchart illustrating a method of manufacturing theelectro-optical device according to the first exemplary embodiment.

FIG. 8 is a schematic cross-sectional view illustrating the method ofmanufacturing the electro-optical device according to the firstexemplary embodiment.

FIG. 9 is a schematic cross-sectional view illustrating the method ofmanufacturing the electro-optical device according to the firstexemplary embodiment.

FIG. 10 is a schematic cross-sectional view illustrating the method ofmanufacturing the electro-optical device according to the firstexemplary embodiment.

FIG. 11 is a schematic cross-sectional view illustrating the method ofmanufacturing the electro-optical device according to the firstexemplary embodiment.

FIG. 12 is a schematic cross-sectional view illustrating the structureof an electro-optical device according to a second exemplary embodiment.

FIG. 13 is an enlarged cross-sectional view illustrating the structureof a color filter and an overcoat layer in the electro-optical deviceaccording to the second exemplary embodiment.

FIG. 14 is a schematic cross-sectional view illustrating the structureof an electro-optical device according to a third exemplary embodiment.

FIG. 15 is an enlarged cross-sectional view illustrating the structureof a color filter in the electro-optical device according to the thirdexemplary embodiment.

FIG. 16 is a schematic diagram illustrating the structure of ahead-mounted display serving as an electronic apparatus according to afourth exemplary embodiment.

FIG. 17 is a plan view schematically illustrating the arrangement of subpixels and a color filter according to a first modified example.

FIG. 18 is a schematic cross-sectional view illustrating the structureof a color filter and an overcoat layer, taken along line D-D□ from FIG.17.

FIG. 19 is a plan view schematically illustrating the arrangement of subpixels and a color filter according to a second modified example.

FIG. 20 is a schematic cross-sectional view illustrating the structureof a color filter and an overcoat layer, taken along line F-F□ from FIG.19.

DESCRIPTION OF EXEMPLARY EMBODIMENTS

Exemplary embodiments of the invention will be described below withreference to the accompanying drawings. Note that in the drawingsreferred to below, the parts described are illustrated in an enlarged orreduced state as appropriate so that those parts can be easilyrecognized.

First Exemplary Embodiment

Electro-Optical Device

An electro-optical device according to this embodiment will be describedwith reference to FIGS. 1 to 4. FIG. 1 is a plan view schematicallyillustrating the electro-optical device according to the first exemplaryembodiment; FIG. 2 is an equivalent circuit diagram illustrating theelectrical configuration of the electro-optical device according to thefirst exemplary embodiment; FIG. 3 is a plan view schematicallyillustrating the arrangement of sub pixels and a color filter in apixel; and FIG. 4 is a schematic cross-sectional view illustrating thestructure of a sub pixel, taken along line A-A□ from FIG. 3. Theelectro-optical device according to this embodiment is a self-luminousmicrodisplay suitable for use as a display unit in a head-mounteddisplay (HMD), which will be described later.

As illustrated in FIG. 1, an electro-optical device 100 according tothis embodiment includes an element substrate 10 and an opposingsubstrate 40. These substrates are disposed facing each other, and arefixed to each other, interposing an adhesive 41 (see FIG. 4).

The element substrate 10 includes a display region E1, in which aplurality of pixels P are arranged in a matrix, and a non-display regionE2, which is a peripheral region further on the outside than the displayregion E1. Each pixel P includes a sub pixel 18B, which emits blue (B)light; a sub pixel 18G, which emits green (G) light; and a sub pixel18R, which emits red (R) light. The electro-optical device 100 providesa full-color display, with each pixel P, including the three sub pixels18B, 18G, and 18R, serving as a unit of the display.

Note that the following descriptions may refer to the sub pixels 18B,18G, and 18R collectively as “sub pixels 18”. Each sub pixel 18 of thisembodiment includes an organic EL element 30 serving as a light-emittingelement (see FIG. 2 or FIG. 4). Accordingly, the display region E1 is anexample of a light-emitting region according to the invention. Note thatthe display region E1 may include a region in which dummy pixels, whichdo not contribute to the display, are disposed, on the outside of theregion in which the plurality of pixels P, which do contribute to thedisplay, are disposed.

The element substrate 10 is an example of a first substrate according tothe invention, is larger than the opposing substrate 40, and has aplurality of external connection terminals 102 arranged along a firstside of the element substrate 10 that protrudes further than theopposing substrate 40. A data line driving circuit 15 is providedbetween the plurality of external connection terminals 102 and thedisplay region E1. A scanning line driving circuit 16 is providedbetween a second side and the display region E1, and also between athird side and the display region E1, the second side and the third sideoppose each other in a direction orthogonal to the first side. Aflexible printed circuit (FPC) 103, for connecting with an externaldriving circuit that supplies control signals pertaining to the display,power, and the like, is mounted to the external connection terminals102.

The opposing substrate 40 is an example of a second substrate accordingto the invention, is slightly smaller than the element substrate 10serving as the first substrate, and is arranged so that the externalconnection terminals 102 are exposed. The opposing substrate 40 is alight-transmissive substrate, and a quartz substrate, a glass substrate,or the like can be used, for example. The opposing substrate 40 has aprotective function for ensuring that the organic EL elements 30(described later), which are disposed in the sub pixels 18, are notdamaged, and is arranged to oppose at least the display region E1. Atop-emission system, in which light emitted from the sub pixels 18 exitsfrom the opposing substrate 40 side, is employed for the electro-opticaldevice 100 of this embodiment.

In the following descriptions, the direction following the first sidealong which the external connection terminals 102 are arranged is an Xdirection, and the direction following the other two sides orthogonal tothe first side and opposing each other (the second side and the thirdside) is a Y direction. The direction oriented from the elementsubstrate 10 toward the opposing substrate 40 is a Z direction.Additionally, a view taken along the Z direction from the opposingsubstrate 40 side will be called a “plan view”.

Electrical Configuration of Organic EL Device

As illustrated in FIG. 2, the electro-optical device 100 includesscanning lines 12 and data lines 13, which intersect with each other,and power lines 14. The scanning lines 12 are electrically connected tothe scanning line driving circuit 16, and the data lines 13 areelectrically connected to the data line driving circuit 15. The subpixels 18 are provided in regions partitioned by the scanning lines 12and the data lines 13.

Each sub pixel 18 includes an organic EL element 30 and a pixel circuit20 that controls the driving of that organic EL element 30.

Each organic EL element 30 is constituted by a pixel electrode 31, alight-emission functional layer 32, and an opposing electrode 33. Thepixel electrode 31 functions as a positive electrode that injects holesinto the light-emission functional layer 32. The opposing electrode 33functions as a negative electrode that injects electrons into thelight-emission functional layer 32. In the light-emission functionallayer 32, excitons (a state where a hole and an electron bind to eachother under Coulomb force) are formed by the injected holes andelectrons, and when the excitons decay (that is, when the holes andelectrons recombine), some of the resulting energy is radiated asfluorescence or phosphorescence. In this embodiment, the light-emissionfunctional layer 32 is configured so that white light is emitted fromthe light-emission functional layer 32.

Each pixel circuit 20 includes a switching transistor 21, a storagecapacitor 22, and a driving transistor 23. The two transistors 21 and 23can be configured using n channel or p channel-type transistors, forexample.

The gate of the switching transistor 21 is electrically connected to thescanning line 12. The source of the switching transistor 21 iselectrically connected to the data line 13. The drain of the switchingtransistor 21 is electrically connected to the gate of the drivingtransistor 23.

The drain of the driving transistor 23 is electrically connected to thepixel electrode 31 of the organic EL element 30. The source of thedriving transistor 23 is electrically connected to the power line 14.The storage capacitor 22 is electrically connected between the gate ofthe driving transistor 23 and the power line 14.

When the switching transistor 21 is driven by the scanning line 12 undera control signal supplied from the scanning line driving circuit 16 andturns to ON state, a potential based on an image signal supplied fromthe data line 13 is stored in the storage capacitor 22 via the switchingtransistor 21. The ON/OFF state of the driving transistor 23 isdetermined in accordance with the potential of the storage capacitor 22,i.e., the gate potential of the driving transistor 23. When the drivingtransistor 23 turns to ON state, an amount of current based on the gatepotential flows to the organic EL element 30 from the power line 14 viathe driving transistor 23. The organic EL element 30 emits light at aluminance based on the amount of current flowing to the light-emissionfunctional layer 32.

Note that the configuration of the pixel circuit 20 is not limited tohaving the two transistors 21 and 23, and for example, a transistor forcontrolling the current flowing to the organic EL element 30 may befurther provided.

Arrangement of Sub Pixels and Color Filters

Next, the arrangement of the sub pixels 18B, 18G, and 18R and a colorfilter 36 in the pixels P will be described with reference to FIG. 3. Asdescribed above, the organic EL element 30 and the pixel circuit 20 areprovided in each sub pixel 18, and thus in the following, an organic ELelement 30 disposed in a sub pixel 18B will be called an organic ELelement 30B; an organic EL element 30 disposed in a sub pixel 18G, anorganic EL element 30G; and an organic EL element 30 disposed in a subpixel 18R, an organic EL element 30R. The pixel electrode 31 in anorganic EL element 30B will be called a pixel electrode 31B; the pixelelectrode 31 in an organic EL element 30G, a pixel electrode 31G; andthe pixel electrode 31 in an organic EL element 30R, a pixel electrode31R.

As illustrated in FIG. 3, in this embodiment, the pixels P are arrangedin a matrix along the X direction and the Y direction. The outer shapeof each pixel P including the sub pixels 18B, 18G, and 18R issubstantially a square, and the pitch at which the pixels P are arrangedin the X direction and the Y direction is 7.5 μm, for example. In eachpixel P, the sub pixel 18B and the sub pixel 18R are arranged adjacentto each other with respect to the Y direction, and the sub pixel 18G isarranged adjacent to the sub pixel 18B and the sub pixel 18R withrespect to the X direction. The sub pixel 18B and the sub pixel 18R aredisposed repeatedly along the Y direction in units of the pixels P. Thesub pixel 18G is also disposed repeatedly along the Y direction in unitsof the pixels P. The range over which emitted light can be obtained fromeach of the sub pixels 18B, 18G, and 18R depends on openings provided inan insulating film 28 (see FIG. 4), which defines a range over which thepixel electrodes 31 of the organic EL elements 30 make contact with thelight-emission functional layer 32 in each of the sub pixels 18B, 18G,and 18R. In FIG. 3, the openings are represented by solid lines, with anopening 28KB provided for each sub pixel 18B, an opening 28KG providedfor each sub pixel 18G, and an opening 28KR provided for each sub pixel18R.

Each of the openings 28KB, 28KG, and 28KR are quadrangular in shape, andthe area ratio of each openings 28KB, 28KG, and 28KR is such that, forexample, when the size of the opening 28KR is “1”, the size of theopening 28KB is “2” and the size of the opening 28KG is “3”. However,the area ratio of the openings 28KB, 28KG, and 28KR is not limitedthereto.

The color filter 36 is disposed on the sub pixels 18B, 18G, and 18R. Thecolor filter 36 is constituted by blue (B) coloring layers 36B, green(G) coloring layers 36G, and red (R) coloring layers 36R. Specifically,because the sub pixels 18B and the sub pixels 18R are arranged adjacentto each other in the Y direction, the coloring layers 36B are disposedindependently for each of the plurality of sub pixels 18B, and likewise,the coloring layers 36R are disposed independently for each of theplurality of sub pixels 18R. The coloring layers 36G are disposed forthe sub pixels 18G. Because the sub pixels 18G are adjacent to eachother in the Y direction, the coloring layers 36G are disposed asstripes for corresponding pluralities of sub pixels 18G arranged in theY direction.

In other words, the coloring layers 36B are disposed independently tooverlap with the openings 28KB. Likewise, the coloring layers 36R aredisposed independently to overlap with the openings 28KR. The coloringlayers 36G are disposed as stripes extending in the Y direction tooverlap with corresponding pluralities of the openings 28KG arranged inthe Y direction.

Although the arrangement of the coloring layers 36B, 36G, and 36R in theelement substrate 10 will be described in more detail later, in thisembodiment, the coloring layers 36B and the coloring layers 36R aredisposed to overlap at the boundaries between the sub pixels 18B and thesub pixels 18R adjacent to each other in the Y direction. The coloringlayers 36B and the coloring layers 36G are disposed to overlap at theboundaries between the sub pixels 18B and the sub pixels 18G adjacent toeach other in the X direction. Likewise, the coloring layers 36R and thecoloring layers 36G are disposed to overlap at the boundaries betweenthe sub pixels 18R and the sub pixels 18G adjacent to each other in theX direction.

In this embodiment, the Y direction in which the coloring layers 36B andthe coloring layers 36R are adjacent is an example of a first directionaccording to the invention, and the X direction orthogonal to the Ydirection is an example of a second direction intersecting with thefirst direction according to the invention. The coloring layer 36B is anexample of a first coloring layer according to the invention, thecoloring layer 36R is an example of a second coloring layer according tothe invention, and the coloring layer 36G is an example of a thirdcoloring layer according to the invention.

The luminance (brightness) of the colors of light obtained from the subpixels 18B, 18G, and 18R depend on the sizes of the openings 28KB, 28KG,and 28KR and the optical characteristics (transmittances) of thecoloring layers 36B, 36G, and 36R overlapping with the openings 28KB,28KG, and 28KR.

Structure of Sub Pixels

Next, the structure of the sub pixels 18 in the electro-optical device100 will be described with reference to FIG. 4. FIG. 4 illustrates across section taken along line A-A□ from FIG. 3, where line A-A□ is aline that crosses the sub pixels 18 in the Y direction, in order fromthe sub pixel 18B, to the sub pixel 18R, and to the sub pixel 18G.

As illustrated in FIG. 4, the electro-optical device 100 includes theelement substrate 10 and the opposing substrate 40, which are disposedopposite each other interposing the adhesive 41. The adhesive 41 servesto affix the element substrate 10 and the opposing substrate 40 to eachother, and is constituted by epoxy resin or acrylic resin, which havelight-transmissive properties, for example. A thermosetting resin, anultraviolet light-curing resin, or a resin cured by both heat andultraviolet light can be used as these resins.

The element substrate 10 includes a base material 11, and a reflectionlayer 25, a light-transmissive layer 26, the organic EL elements 30, asealing layer 34, and the color filter 36, which are laminated in thatorder in the Z direction on the base material 11.

The base material 11 is a semiconductor substrate such as silicon, forexample. The scanning lines 12, the data lines 13, the power lines 14,the data line driving circuit 15, the scanning line driving circuit 16,the pixel circuits 20 (the switching transistors 21, the storagecapacitors 22, and the driving transistors 23), and the like of theabove-described equivalent circuit are formed in the base material 11using a known technique. These lines, circuit configurations, and thelike are not illustrated in FIG. 4.

Note that the base material 11 is not limited to a semiconductorsubstrate such as silicon, and may instead be a substrate constituted byquartz, glass, or the like, for example. In other words, the transistorsconstituting the pixel circuits 20 may be MOS type transistors having anactive layer in the semiconductor substrate, or may be thin-filmtransistors or field-effect transistors formed in a substrateconstituted by quartz, glass, or the like.

The reflection layer 25 is disposed spanning the sub pixels 18B, 18R,and 18G, and reflects light emitted from the organic EL elements 30B,30R, and 30G of the respective sub pixels 18B, 18R, and 18G back towardthe opposing substrate 40 side. A material that can realize a highreflectivity, such as aluminum, silver, or an alloy of such metals, isused as the material for forming the reflection layer 25.

The light-transmissive layer 26 is provided on the reflection layer 25.The light-transmissive layer 26 is constituted by a first insulatingfilm 26 a, a second insulating film 26 b, and a third insulating film 26c. The first insulating film 26 a is disposed on the reflection layer25, spanning the sub pixels 18B, 18R, and 18G. The second insulatingfilm 26 b is laminated on the first insulating film 26 a, and isdisposed spanning the sub pixels 18R and the sub pixels 18G. The thirdinsulating film 26 c is laminated on the second insulating film 26 b,and is disposed on the sub pixels 18R. The insulating films areconstituted by silicon oxide, for example.

In other words, the light-transmissive layer 26 of the sub pixel 18B isconstituted by the first insulating film 26 a, the light-transmissivelayer 26 of the sub pixel 18G is constituted by the first insulatingfilm 26 a and the second insulating film 26 b, and thelight-transmissive layer 26 of the sub pixel 18R is constituted by thefirst insulating film 26 a, the second insulating film 26 b, and thethird insulating film 26 c. As such, the thickness of thelight-transmissive layer 26 increases in order from the sub pixel 18B,to the sub pixel 18G, and to the sub pixel 18R.

The organic EL elements 30 are provided on the light-transmissive layer26. Each organic EL element 30 includes the pixel electrode 31, thelight-emission functional layer 32, and the opposing electrode 33,laminated in that order in the Z direction. The pixel electrodes 31 areconstituted by a transparent conductive film such as indium tin oxide(ITO) film, and are formed having island shapes for each of thecorresponding sub pixels 18.

The insulating film 28 is disposed to cover edge portions of the pixelelectrodes 31B, 31R, and 31G. As described above, the opening 28KB isformed in the insulating film 28 over the pixel electrode 31B; theopening 28KR, over the pixel electrode 31R; and the opening 28KG, overthe pixel electrode 31G. The insulating film 28 is constituted bysilicon oxide, for example.

In the areas where the openings 28KB, 28KR, and 28KG are provided, thepixel electrodes 31 (31B, 31R, and 31G) contact the light-emissionfunctional layer 32, and the light-emission functional layer 32 emitslight when holes are supplied from the pixel electrodes 31 to thelight-emission functional layer 32 and electrons are supplied from theopposing electrode 33. In other words, the regions where the openings28KB, 28KR, and 28KG are provided serve as regions in each of the subpixels 18B, 18R, and 18G where the light-emission functional layer 32emits light. In the regions where the insulating film 28 is provided,the supply of holes from the pixel electrodes 31 to the light-emissionfunctional layer 32 is suppressed, and thus light emission from thelight-emission functional layer 32 is suppressed.

The light-emission functional layer 32 is disposed to span the subpixels 18B, 18R, and 18G and cover the entirety of the display region E1(see FIG. 1). The light-emission functional layer 32 includes, forexample, a hole injection layer, a hole transport layer, an organiclight-emission layer, an electron transport layer, and the like, whichare laminated in that order in the Z direction. The organiclight-emission layer emits light in a wavelength range from blue to red.The organic light-emission layer may be constituted by a single layer,or may be constituted by a plurality of layers including a bluelight-emitting layer, a green light-emitting layer, and a redlight-emitting layer, for example, or including a blue light-emittinglayer as well as a yellow light-emitting layer that can emit lightincluding the wavelength ranges of red (R) and green (G).

The opposing electrode 33 is disposed to cover the light-emissionfunctional layer 32. The opposing electrode 33 is constituted by analloy of magnesium and silver, for example, and the thickness of theopposing electrode 33 is controlled, so that the electrode is bothlight-transmissive and reflective.

The sealing layer 34 that covers the opposing electrode 33 isconstituted by a first sealing layer 34 a, a flattening layer 34 b, anda second sealing layer 34 c, which are laminated in that order in the Zdirection. The first sealing layer 34 a and the second sealing layer 34c are inorganic sealing layers formed using an inorganic material.Silicon oxide, silicon nitride, silicon oxynitride, aluminum oxide, andthe like, which are not easily permeated by moisture, oxygen, and thelike, can be given as examples of the inorganic material. This sealinglayer 34 is formed across at least the display region E1 in which thelight-emission functional layer 32 (the organic EL elements 30) isdisposed.

Vacuum deposition, ion implanting, sputtering, CVD, and the like can begiven as examples of the method of forming the first sealing layer 34 aand the second sealing layer 34 c. From the standpoint of avoidingthermal damage to the organic EL elements 30, it is desirable thatvacuum deposition or ion implanting be used. The thicknesses of thefirst sealing layer 34 a and the second sealing layer 34 c are, forexample, from approximately 50 nm to approximately 1000 nm, andpreferably from approximately 200 nm to approximately 400 nm, to make itdifficult for cracks and the like to be generated during depositionwhile also ensuring that the layers are light-transmissive.

The flattening layer 34 b is a transmissive organic sealing layer, andcan be formed using a resin material such as a heat- or ultravioletlight-curing epoxy resin, acrylic resin, urethane resin, silicone resin,or the like, for example. The flattening layer 34 b is laminated uponthe first sealing layer 34 a covering a plurality of the organic ELelements 30.

The flattening layer 34 b covers defects (pinholes, cracks) arising whendepositing the first sealing layer 34 a, foreign materials, or the liketo form a substantially flat surface. Unevenness arises in the surfaceof the first sealing layer 34 a due to the influence of the differentthicknesses in the light-transmissive layer 26, and it is thuspreferable that the flattening layer 34 b be formed at a thickness offrom approximately 1 μm to approximately 5 μm, for example, to eliminatesuch unevenness. This makes it unlikely that the color filter 36 formedon the sealing layer 34 will be affected by such unevenness. From thestandpoint of eliminating the unevenness caused by thelight-transmissive layer 26, it is preferable that the flattening layer34 b be constituted by an organic sealing layer that can be made thickerwith ease; however, the flattening layer 34 b may be formed using acoating type inorganic material (silicon oxide or the like) instead.

The color filter 36 is formed on the sealing layer 34. The color filter36 is constituted by the coloring layers 36B, 36G, and 36R, which areformed through photolithography by using a photosensitive resin materialcontaining blue (B), green (G), and red (R) color materials. Thecoloring layers 36B are formed corresponding to the sub pixels 18B; thecoloring layers 36R, to the sub pixels 18R; and the coloring layers 36G,to the sub pixels 18G.

Adjacent coloring layers of different colors are formed to partiallyoverlap with each other at the boundaries between sub pixels 18 on thesealing layer 34.

The coloring layers 36B, 36R, and 36G are formed by first applyingphotosensitive resin materials containing color materials of therespective colors through a method such as spin coating to form aphotosensitive resin layer, and then exposing and developing thephotosensitive resin layer using photolithography. In this embodiment,the coloring layers 36G, the coloring layers 36B, and the coloringlayers 36R are formed in that order.

Accordingly, the edges of the coloring layers 36G in the X direction arecovered by the edges of the coloring layers 36B and the edges of thecoloring layers 36R, and the edges of the coloring layers 36B in the Ydirection are covered by the edges of the coloring layers 36R.

An overcoat (OC) layer 50 is provided to overlap with the coloringlayers 36B and the coloring layers 36R, which of the three colors ofcoloring layers 36B, 36G, and 36R, are disposed adjacent to each otherand repeating in the Y direction. While the OC layer 50 does cover partscorresponding to the boundaries between the coloring layers 36R (thecoloring layers 36B) and the coloring layers 36G, the OC layer 50 is notprovided at parts aside from the boundaries of the coloring layers 36G.Although the method of forming the OC layer 50 will be described indetail later, the OC layer 50 is formed by first applying a transmissivephotosensitive resin material through a method such as spin coating toform a photosensitive resin layer, and then exposing and developing thephotosensitive resin layer using photolithography. In other words, byforming the OC layer 50 to cover the coloring layers 36B and thecoloring layers 36R, grooves 50 a that follow the Y direction alongwhich the coloring layers 36G extend are formed on the surface of thecolor filter 36 that is affixed to the adhesive 41. The grooves 50 a areformed along the coloring layers 36G corresponding to one color. Thegrooves 50 a are an example of protrusions and recesses in a stripepattern in an adhesive surface of the color filter, according to theinvention.

Optical Resonance Structure

The electro-optical device 100 according to this embodiment is providedwith an optical resonance structure between the reflection layer 25 andthe opposing electrode 33. In the electro-optical device 100, lightemitted by the light-emission functional layer 32 is repeatedlyreflected between the reflection layer 25 and the opposing electrode 33,the intensity of light of a specific wavelength (a resonant wavelength)corresponding to the optical distance between the reflection layer 25and the opposing electrode 33 is amplified, and the light passingthrough the color filter 36 is emitted from the opposing substrate 40 inthe Z direction as display light.

In this embodiment, the light-transmissive layer 26 has a function ofadjusting the optical distance between the reflection layer 25 and theopposing electrode 33. As described above, the thickness of thelight-transmissive layer 26 increases in order from the sub pixel 18B,to the sub pixel 18G, and to the sub pixel 18R. As a result, the opticaldistance between the reflection layer 25 and the opposing electrode 33increases in order from the sub pixel 18B, to the sub pixel 18G, and tothe sub pixel 18R. Note that the optical distance can be expressed asthe total of the products of the refractive indices and thicknesses ofeach layer between the reflection layer 25 and the opposing electrode33.

For example, in the sub pixels 18B, the thickness of thelight-transmissive layer 26 is set so that the resonant wavelength (apeak wavelength of maximum luminance) is 470 nm. In the sub pixels 18G,the thickness of the light-transmissive layer 26 is set so that theresonant wavelength is 540 nm. In the sub pixels 18R, the thickness ofthe light-transmissive layer 26 is set so that the resonant wavelengthis 610 nm.

As a result, blue light (B) having a peak wavelength of 470 nm isemitted from the sub pixels 18B, green light (G) having a peakwavelength of 540 nm is emitted from the sub pixels 18G, and red light(R) having a peak wavelength of 610 nm is emitted from the sub pixels18R. In other words, the electro-optical device 100 has an opticalresonance structure that amplifies the intensity of light at a specificwavelength, where a blue light component is obtained from the whitelight emitted from the light-emission functional layer 32 in the subpixels 18B, a green light component is obtained from the white lightemitted from the light-emission functional layer 32 in the sub pixels18G, and a red light component is obtained from the white light emittedfrom the light-emission functional layer 32 in the sub pixels 18R.

Note that rather than using the light-transmissive layer 26, theconfiguration for adjusting the optical distance between the reflectionlayer 25 and the opposing electrode 33 may be realized by varying thethicknesses of the pixel electrodes 31 (31B, 31G, and 31R).

The color filter 36 is disposed on the sealing layer 34 in the subpixels 18B, 18G, and 18R. The coloring layers 36B are disposed on theorganic EL elements 30B of the sub pixels 18B, with the sealing layer 34interposed between the organic EL elements 30B and the coloring layers36B. Accordingly, the color purity can be increased by the blue light(B), which has a peak wavelength of 470 nm, passing through the coloringlayers 36B. Likewise, the coloring layers 36G are disposed on theorganic EL elements 30G of the sub pixels 18G, with the sealing layer 34interposed between the organic EL elements 30G and the coloring layers36G, and the coloring layers 36R are disposed on the organic EL elements30R of the sub pixels 18R, with the sealing layer 34 interposed betweenthe organic EL elements 30R and the coloring layers 36R. Accordingly,the color purity can be increased by the green light (G), which has apeak wavelength of 540 nm, passing through the coloring layers 36G, andthe color purity can be increased by the red light (R), which has a peakwavelength of 610 nm, passing through the coloring layers 36R.

The optical characteristics, such as the color purity of the respectivecolors of light, depend on the thicknesses of the coloring layers 36B,36G, and 36R. In this embodiment, the blue coloring layers 36B and thered coloring layers 36R are formed to have an average thickness on thesealing layer 34 of 2 μm, and similarly, the green coloring layers 36Gare formed to have an average thickness of approximately 1 μm. Note thatthe settings for the thicknesses of the coloring layers 36B, 36G, and36R are not limited thereto.

As described above, the light emitted from the sub pixels 18 is lightemitted from the opposing electrode 33 toward the sealing layer 34 andpassing through the coloring layers 36B, 36G, and 36R and is lighthaving different spectra than the spectrum of the light emitted withinthe light-emission functional layer 32 of the organic EL elements 30.

Structure for Affixing Element Substrate and Opposing Substrate

Next, a structure for affixing the element substrate 10 and the opposingsubstrate 40 will be described with reference to FIGS. 5 and 6. FIG. 5is a plan view schematically illustrating the arrangement of alight-shielding portion in the element substrate, and FIG. 6 is aschematic cross-sectional view illustrating the structure of theelectro-optical device, taken along line C-C□ from FIG. 5. Line C-C□ inFIG. 5 is a line that crosses the light-shielding portion and thedisplay region E1 in the X direction. Note that in FIG. 6, the pixelcircuits 20 in the element substrate 10, as well as the scanning lines12, the data lines 13, the power lines 14, the data line driving circuit15, and the scanning line driving circuit 16 connected to the pixelcircuits 20, are not illustrated.

As illustrated in FIG. 5, the element substrate 10 of theelectro-optical device 100 is provided with a frame-shapedlight-shielding portion 36S surrounding the display region E1. Thelight-portion 36S is provided to overlap with the scanning line drivingcircuit 16 (see FIG. 1), which is provided in the non-display region E2located on the outside of the display region E1, when viewed in planview. A dummy color filter region E4 (called a “dummy CF region E4”hereinafter) is provided between the inner edges of the frame-shapedlight-shielding portion 36S and the display region E1. Providing theframe-shaped light-shielding portion 36S surrounding the display regionE1 in this manner results in a configuration making it possible toprevent the light emitted from the display region E1 from beingreflected by other parts and affecting the display light, or enteringthe peripheral circuits such as the scanning line driving circuit 16 anddestabilizing the operations of the transistors and the like included inthe peripheral circuits. The region in which the light-shielding portion36S is provided in a frame shape will be called a “light-shieldingregion E3” hereinafter.

As illustrated in FIG. 6, the element substrate 10 and the opposingsubstrate 40 are disposed opposing each other, and are affixed to eachother, interposing the adhesive 41. The light-emission functional layer32 and the opposing electrode 33, which partially constitute the organicEL element 30, are provided on the base material 11 of the elementsubstrate 10 across the display region E1. The sealing layer 34 isprovided covering the light-emission functional layer 32 and theopposing electrode 33. Outer edge 34 e of the sealing layer 34 islocated slightly further to the outside than the light-shielding regionE3 (see FIG. 5).

The coloring layers 36B, 36G, and 36R are provided on the sealing layer34, in the display region E1, to correspond to the sub pixels 18B, 18G,and 18R of the pixels P. The above-described light-shielding portion 36Sis provided in a position surrounding the display region E1. Thelight-shielding portion 36S is configured to shield entering light as aresult of laminating the coloring layers 36G, the coloring layers 36B,and the coloring layers 36R in that order. The width of the frame-shapedlight-shielding portion 36S (the light-shielding region E3) on thesealing layer 34 is, for example, from approximately 0.5 mm toapproximately 1.0 mm.

The coloring layer 36R is provided as a dummy CF on the sealing layer34, in the dummy CF region E4 between the light-shielding portion 36Sand the color filter 36 corresponding to the pixels P in the displayregion E1. The dummy CF is not limited to the red (R) coloring layer36R, and another color of coloring layer may be used; however, it ispreferable that the coloring layer 36R, which is thicker than thecoloring layer 36G, be used in consideration of light leakage. The widthof the dummy CF region E4 between the display region E1 and thelight-shielding region E3 is, for example, from 50 μm to 300 μm.

As described above, in the display region E1, the stripe-shaped OC layer50 is provided to overlap with the coloring layers 36B and the coloringlayers 36R which, of the color filter 36, are arranged in the Ydirection. The pixels P thus include the parts where the OC layer 50 isprovided, and the parts where the OC layer 50 is not provided and thegrooves 50 a are formed between the adjacent pixels P. In other words,the grooves 50 a, serving as protrusions and recesses in a stripepattern extending in the Y direction for each pixel P arranged in the Xdirection, are provided in the adhesive surface of the color filter 36that makes contact with the adhesive 41. Note that the number of stripesin the OC layer 50 and grooves 50 a in the display region E1,illustrated in FIG. 5, is determined by the number of pixels P arrangedin the X direction. FIGS. 5 and 6 illustrate the stripe-shaped OC layer50 and grooves 50 a at a number that is visually recognizable.

Method of Manufacturing Electro-Optical Device

Next, a method of manufacturing the electro-optical device 100 will bedescribed with reference to FIGS. 7 to 11. FIG. 7 is a flowchartillustrating the method of manufacturing the electro-optical deviceaccording to the first exemplary embodiment, and FIGS. 8 to 11 areschematic cross-sectional views illustrating the method of manufacturingthe electro-optical device according to the first exemplary embodiment.

As illustrated in FIG. 7, the method of manufacturing theelectro-optical device 100 includes a process of forming the pluralityof organic EL elements 30 on the base material 11 (step S1), a sealinglayer formation process of forming the sealing layer 34 for sealing theplurality of organic EL elements 30 (step S2), a color filter formationprocess of forming the color filter 36 on the sealing layer 34 (stepS3), an overcoat (OC) formation process of forming the overcoat (OC)layer 50 (step S4), and a process of affixing the opposing substrate 40to the element substrate 10 (step S5). Note that as described above, aknown method can be used for the processes for forming the peripheralcircuits such as the data line driving circuit 15 and the scanning linedriving circuit 16, the pixel circuits 20, the lines connecting thosecircuits, the external connection terminals 102, and the like in thebase material 11. The same applies to the reflection layer 25 and thelight-transmissive layer 26. Therefore, the process will be describedfrom step S1.

Step S1 is a process of forming the organic EL elements 30, in which thepixel electrodes 31 are formed in the display region E1 for each of thesub pixels 18, the light-emission functional layer 32 and the opposingelectrode 33 are formed spanning a plurality of the sub pixels 18, andthe organic EL elements 30 are formed for each of the sub pixels 18.Then, the process proceeds to step S2.

Step S2 is a process of forming the sealing layer 34, in which thesealing layer 34, which seals the plurality of organic EL elements 30formed in the display region E1, is formed. To be more specific, thefirst sealing layer 34 a is formed, using an inorganic material, tocover the opposing electrode 33. The flattening layer 34 b is thenformed by forming the organic sealing layer using a resin material andthen patterning the organic sealing layer. The second sealing layer 34 cis then formed using an inorganic material to cover the flattening layer34 b as well as the first sealing layer 34 a protruding from theflattening layer 34 b. The sealing layer 34 is formed as a result. Notethat from the standpoint of improving the sealing characteristics, it ispreferable that the first sealing layer 34 a and the second sealinglayer 34 c, which are constituted by an inorganic material, are formedto sandwich the flattening layer 34 b, which is constituted by anorganic material, and to extend to the outer peripheral ends of the basematerial 11. Then, the process proceeds to step S3.

Step S3 is a process of forming the color filter 36, in which thecoloring layers 36B, 36G, and 36R are formed on the sealing layer 34 inthe display region E1, corresponding to the three sub pixels 18B, 18G,and 18R. As described above, in the method of forming the coloringlayers 36B, 36G, and 36R, photosensitive resin materials containing thecolor materials are first applied through spin coating to form aphotosensitive resin layer, and the photosensitive resin layer is thenexposed and developed using photolithography. In this embodiment, thecoloring layers 36G, the coloring layers 36B, and the coloring layers36R are formed in that order. Additionally, in the process of formingthe color filter 36, the light-shielding portion 36S is formed in thelight-shielding region E3 surrounding the display region E1 bylaminating the three coloring layers 36G, 36B, and 36R in that order, atthe same time as when the coloring layers 36G, 36B, and 36R are formedin the display region E1. Furthermore, in this embodiment, the coloringlayer 36R, which, of the three coloring layers 36B, 36G, and 36R, is thethickest and thus contributes the most to the light-shieldingproperties, is formed in the dummy CF region E4 between the displayregion E1 and the light-shielding region E3. Note that the order inwhich the three color of the coloring layers 36B, 36G, and 36R areformed is not limited to green (G), blue (B), and red (R). Becausecoloring layers having different colors overlap at the boundariesbetween sub pixels 18, it is preferable that the thinnest layer beformed first. Then, the process proceeds to step S4.

Step S4 is a process of forming the overcoat (OC) layer 50, in which theOC layer 50 is first formed covering the color filter 36 formed in thedisplay region E1, the light-shielding portion 36S, and the coloringlayer 36R serving as the dummy CF, through spin coating or the likeusing a photosensitive resin material that does not contain a colormaterial, for example, as illustrated in FIG. 8. At this time, thethickness of the OC layer 50 is approximately 1 μm, for example.

Next, as illustrated in FIG. 9, the OC layer 50 is irradiated withultraviolet (UV) light, for example, over an exposure mask 60. Alight-shielding pattern 61 is provided in the mask 60. Thelight-shielding pattern 61 includes a plurality of stripe-shapedlight-shielding layers extending in the Y direction in positionsoverlapping with the coloring layers 36B and the coloring layers 36Rformed in the display region E1. The light-shielding pattern 61 alsoincludes a light-shielding layer formed in a frame shape, in positionsoverlapping the coloring layer 36R formed in the dummy CF region E4.

Once the OC layer 50 irradiated with ultraviolet (UV) light isdeveloped, the OC layer 50 is formed having been patterned to overlapwith the coloring layers 36B and the coloring layers 36R in the displayregion E1 and to overlap with the coloring layer 36R serving as thedummy CF in the dummy CF region E4, as illustrated in FIG. 10. As aresult, the grooves 50 a are formed in the patterned OC layer 50 toextend in the Y direction, in positions overlapping the coloring layers36G in the display region E1. The OC layer 50 is formed on the innerside of the light-shielding portion 36S. Because the OC layer 50 isformed to cover the coloring layers 36B and the coloring layers 36Rarranged in the Y direction, the thicknesses of the coloring layers 36Band the coloring layers 36R may differ. Then, the process proceeds tostep S5.

Step S5 is a process of affixing the element substrate 10, on which theOC layer 50 is formed, to the opposing substrate 40, using the adhesive41. Specifically, as illustrated in FIG. 11, a prescribed amount of theadhesive 41 is applied on the color filter 36 of the element substrate10, after which the opposing substrate 40 is pressed toward the elementsubstrate 10 from above so that the applied adhesive 41 spreads out.Because the plurality of grooves 50 a, which follow the Y direction, areformed in the adhesive surface of the color filter 36, the adhesive 41spreads out along the plurality of grooves 50 a.

Because the light-shielding portion 36S surrounding the display regionE1 is formed from the three coloring layers 36G, 36B, and 36R laminatedin that order, the height of the light-shielding portion 36S on thesealing layer 34 is approximately 5 μm. However, the height of the colorfilter 36 on the sealing layer 34 is a maximum of approximately 2 μm.The OC layer 50, which is approximately 1 μm thick, is formed on thecoloring layer 36R serving as the dummy CF provided between thelight-shielding region E3 and the display region E1. Therefore, as thesubstantial height of the dummy CF on the sealing layer 34 isapproximately 3 μm, a level difference between the light-shieldingportion 36S and the color filter 36 can be reduced as compared to a casewhere the dummy CF is not provided. The adhesive 41 that has spread outon the color filter 36 fills the level difference between thelight-shielding portion 36S and the color filter 36, and passes over thelight-shielding portion 36S, more easily than in the past. The adhesive41 is cured in a state where the adhesive 41 has spread to apredetermined application range on the base material 11, and the elementsubstrate 10 is affixed to the opposing substrate 40 as a result.

The electro-optical device 100 illustrated in FIG. 1 is completed bythen mounting the FPC 103 to the terminal parts of the element substrate10.

According to the electro-optical device 100 and the method ofmanufacturing the electro-optical device 100 of the first exemplaryembodiment, the following effects can be achieved.

(1) In the color filter 36, the coloring layers 36B and the coloringlayers 36R are formed so that the end parts of those layers overlap eachother at the boundaries in the Y direction. Additionally, the coloringlayers 36G are formed so that the end parts of the coloring layers 36Goverlap with the coloring layers 36B and the coloring layers 36R at theboundaries in the X direction. The OC layer 50 is then formed on thecolor filter 36 of this element substrate 10 through patterning, inpositions overlapping with the coloring layers 36B and the coloringlayers 36R arranged in the Y direction. As a result, the plurality ofgrooves 50 a, serving as protrusions and recesses in a stripe patternextending in the Y direction, are formed in the surface of the colorfilter 36 affixed to the adhesive 41. The grooves 50 a are formed inpositions overlapping with the coloring layers 36G, which similarlyextend in the Y direction, in the sub pixels 18G. In other words, thereis no level difference in the base part of the grooves 50 a. In theaffixing process, where the element substrate 10 and the opposingsubstrate 40 are affixed to each other, the adhesive 41 spreads outalong the plurality of grooves 50 a when the opposing substrate 40 ispressed so that the adhesive 41 applied to the element substrate 10spreads out. Accordingly, it is more difficult for unevenness to arisein the adhesive 41 than when complex level differences are present inthe color filter 36 due to the three coloring layers 36B, 36G, and 36Rhaving different thicknesses and the OC layer 50 not being present, forexample. Additionally, the adhesive 41 spreads out along the pluralityof grooves 50 a, which extend in the Y direction serving as the firstdirection and which have no level differences in their base parts, andit is therefore difficult for bubbles to form in the grooves 50 a. Inother words, an electro-optical device 100 in which bubbles that affectthe display do not easily form, and a method of manufacturing theelectro-optical device 100, can be provided.

(2) The light-shielding portion 36S formed in a position surrounding thedisplay region E1 is formed by laminating the three coloring layers 36G,36B, and 36R, which have different colors, in that order, and the heightof the light-shielding portion 36S on the sealing layer 34 isapproximately 5 μm. The dummy CF region E4 is provided, in a frameshape, between the light-shielding region E3 where the light-shieldingportion 36S is provided and the display region E1 where the color filter36 is provided. The red coloring layer 36R, serving as the dummy CF, andthe OC layer 50, formed through patterning, are provided in the dummy CFregion E4. The combined height of the coloring layer 36R and the OClayer 50 on the sealing layer 34 is 3 μm. In other words, forming thedummy CF region E4 between the light-shielding region E3 and the displayregion E1 in this manner makes it possible to reduce the leveldifference between the light-shielding portion 36S and the color filter36 while maintaining light-shielding properties. Accordingly, whenaffixing the element substrate 10 and the opposing substrate 40 usingthe adhesive 41, a situation in which the substrates are affixed withbubbles present between the light-shielding portion 36S, which is thehighest part on the sealing layer 34, and the color filter 36, can besuppressed.

(3) The plurality of grooves 50 a obtained by patterning the OC layer 50are formed to overlap with the coloring layers 36G, which are thethinnest of the three coloring layers 36B, 36G, and 36R. Accordingly,the grooves 50 a are deeper, and it is thus easier to restrict thedirection in which the adhesive 41 spreads out when affixing the elementsubstrate 10 and the opposing substrate 40, than when the thickness ofthe coloring layers 36G is the same as the other coloring layers 36B and36R. This makes it possible to suppress unevenness in the application ofthe adhesive 41 and achieve a uniform application state. In other words,the coloring layers 36G arranged in the X direction, serving as thesecond direction intersecting with the Y direction, have a differentthickness from, and are preferably thinner than, the coloring layers 36Band 36R arranged in the Y direction, serving as the first direction inwhich the OC layer 50 is formed.

The pixels P of the electro-optical device 100 according to the firstexemplary embodiment described above are configured so that the subpixels 18B (the coloring layers 36B) and the sub pixels 18R (thecoloring layers 36R) are arranged in the Y direction serving as thefirst direction, and the sub pixels 18G (the coloring layers 36G) arearranged in the X direction, serving as the second direction, withrespect to the sub pixels 18B (the coloring layers 36B) and the subpixels 18R (the coloring layers 36R). However, the configuration is notlimited thereto. For example, the configuration may be such that the subpixels 18B (the coloring layers 36B) and the sub pixels 18R (thecoloring layers 36R) are arranged in the X direction serving as thefirst direction, and the sub pixels 18G (the coloring layers 36G) arearranged in the Y direction, serving as the second direction, withrespect to the sub pixels 18B (the coloring layers 36B) and the subpixels 18R (the coloring layers 36R). In this case, the configuration issuch that the plurality of grooves 50 a, extending in the X directionand serving as protrusions and recesses in a stripe pattern, areprovided in the adhesive surface of the color filter 36. In other words,the direction in which the plurality of grooves 50 a, serving as theprotrusions and recesses in a stripe pattern extend, is not limited tothe Y direction, and may be the X direction instead.

Second Exemplary Embodiment

Next, an electro-optical device, and a method of manufacturing theelectro-optical device, according to a second exemplary embodiment willbe described with reference to FIGS. 12 and 13. FIG. 12 is a schematiccross-sectional view illustrating the structure of the electro-opticaldevice according to the second exemplary embodiment, and FIG. 13 is anenlarged cross-sectional view illustrating the structure of a colorfilter and an overcoat layer in the electro-optical device according tothe second exemplary embodiment. Note that FIG. 12 is a schematiccross-sectional view corresponding to FIG. 6, described in the foregoingfirst exemplary embodiment.

An electro-optical device 200 of the second exemplary embodiment differsfrom the electro-optical device 100 of the foregoing first exemplaryembodiment in terms of the configuration of the overcoat layer 50. Therest of the configuration is the same, and thus elements that are thesame as those in the electro-optical device 100 of the foregoing firstexemplary embodiment will be given the same reference signs, and willnot be given detailed descriptions.

As illustrated in FIG. 12, the electro-optical device 200 of thisembodiment is a self-luminous display device in which an elementsubstrate 210, which includes a plurality of organic EL elements 30 andthe color filter 36, and a transmissive opposing substrate 40, aredisposed opposing each other, and are affixed to each other, interposingthe adhesive 41.

In the element substrate 210, each of the plurality of pixels P arrangedin the display region E1 includes the three sub pixels 18B, 18G, and18R. Each of the sub pixels 18B, 18G, and 18R has an organic EL element30, which includes the light-emission functional layer 32 formed betweenthe pixel electrode 31 and the opposing electrode 33. The light-emissionfunctional layer 32 and the opposing electrode 33 are formed across thedisplay region E1, and are sealed by the sealing layer 34.

The color filter 36 is formed on the sealing layer 34, in the displayregion E1. The color filter 36 is configured including the blue coloringlayers 36B, the green coloring layers 36G, and the red coloring layers36R, which are formed corresponding to the sub pixels 18B, 18G, and 18R.

The frame-shaped dummy CF region E4 is provided on the sealing layer 34,in a position surrounding the display region E1, and the red coloringlayer 36R is formed as the dummy CF in the dummy CF region E4.Furthermore, the similarly frame-shaped light-shielding portion 36S(light-shielding region E3) is provided surrounding the dummy CF regionE4. The light-shielding portion 36S is formed by laminating the coloringlayers 36G, 36B, and 36R, which have different colors, in that order.The average thickness of the coloring layers 36G is approximately 1 μm,and the average thickness of the coloring layers 36B and the coloringlayers 36R is approximately 2 μm.

A first overcoat (OC) layer 51 is formed to cover the coloring layers36B, 36G, and 36R in the display region E1 and the coloring layer 36R inthe dummy CF region E4. Furthermore, a second overcoat (OC) layer 52 isformed through patterning, on the first overcoat (OC) layer 51, inpositions overlapping, when viewed in plan view, with the coloringlayers 36B and the coloring layers 36R arranged in the Y direction. Inother words, the overcoat (OC) layer 50 according to this embodimentincludes the first OC layer 51, formed across the display region E1 andthe dummy CF region E4, and the second OC layer 52, which is formedhaving stripe shapes extending in the Y direction for each pixel P.

In other words, a plurality of grooves 52 a, serving as protrusions andrecesses in a stripe pattern extending in the Y direction, are formed inthe surface of the color filter 36, in the element substrate 210, thatis affixed to the adhesive 41, the grooves 52 a being formed by thefirst OC layer 51 and the second OC layer 52 formed through patterning.As illustrated in FIG. 13, the grooves 52 a are formed in positionsoverlapping with the coloring layers 36G in the color filter 36. Thethickness of the first OC layer 51 on the color filter 36 is, forexample, 1.5 μm, from the standpoint of covering the color filter 36across the display region E1 and ensuring flatness. The thickness of thesecond OC layer 52 on the first OC layer 51 is thinner than thethickness of the first OC layer 51 at, for example, 1 μm, to regulatethe depth of the grooves 52 a.

The method of manufacturing the electro-optical device 200 is basicallyconfigured same as the method of manufacturing the electro-opticaldevice 100 of the foregoing first exemplary embodiment, with theovercoat layer formation process (step S4) according to this embodimentincluding a process of forming the transmissive first OC layer 51covering the color filter 36, and a process of forming the second OClayer 52 on the first OC layer 51, extending in the Y direction servingas the first direction. The first OC layer 51 and the second OC layer 52are both formed through photolithography, using a transmissivephotosensitive resin material.

According to the electro-optical device 200 and the method ofmanufacturing the electro-optical device 200 of the second exemplaryembodiment, the following effects can be achieved.

(1) Regardless of how the thicknesses of the three coloring layers 36B,36G, and 36R constituting the color filter 36 are set, the plurality ofgrooves 52 a, serving as protrusions and recesses in a stripe patternextending in the Y direction, are formed by the first OC layer 51 andthe second OC layer 52 formed through patterning, on the surface of thecolor filter 36 that is affixed to the adhesive 41. In other words, evenif the thicknesses of the three coloring layers 36B, 36G, and 36R aredifferent and complex level differences are produced on the color filter36, the color filter 36 is covered by the first OC layer 51, and it isthus difficult for unevenness in the application of the adhesive 41 toarise in the process of affixing the element substrate 210 and theopposing substrate 40. Additionally, the adhesive 41 spreads out alongthe plurality of grooves 52 a, which extend in the Y direction servingas the first direction and which have no level differences in their baseparts, and it is therefore difficult for bubbles to form in the grooves52 a. In other words, an electro-optical device 200 in which bubblesthat affect the display do not easily form, and a method ofmanufacturing the electro-optical device 200, can be provided.

(2) The first OC layer 51 and the second OC layer 52 are laminated, inaddition to the coloring layer 36R serving as the dummy CF, in the dummyCF region E4 between the light-shielding region E3 and the displayregion E1, and the height of those layers on the sealing layer 34 isapproximately 4.5 μm. Accordingly, level differences between thelight-shielding portion 36S and the color filter 36 can be reduced evenmore than in the configuration of the foregoing first exemplaryembodiment. Additionally, in the process of affixing the elementsubstrate 210 and the opposing substrate 40 using the adhesive 41, theadhesive 41 easily passes over the light-shielding portion 36S, and asituation in which the substrates are affixed with bubbles presentbetween the light-shielding portion 36S, which is the highest part onthe sealing layer 34, and the color filter 36, can be suppressed.

Because the color filter 36 is covered by the first OC layer 51, leveldifferences pertaining to the setting of the thicknesses of the coloringlayers 36B, 36G, and 36R do not affect the affixing process, and thusthe direction in which the second OC layer 52 formed on the first OClayer 51 extends is not limited to the Y direction, and may be the Xdirection instead.

Third Exemplary Embodiment

Next, an electro-optical device, and a method of manufacturing theelectro-optical device, according to a third exemplary embodiment willbe described with reference to FIGS. 14 and 15. FIG. 14 is a schematiccross-sectional view illustrating the structure of the electro-opticaldevice according to the third exemplary embodiment, and FIG. 15 is anenlarged cross-sectional view illustrating the structure of a colorfilter in the electro-optical device according to the third exemplaryembodiment. Note that FIG. 14 is a schematic cross-sectional viewcorresponding to FIG. 6, described in the foregoing first exemplaryembodiment.

An electro-optical device 300 of the third exemplary embodiment differsfrom the electro-optical device 100 of the foregoing first exemplaryembodiment in that the overcoat layer 50 is omitted. The rest of theconfiguration is the same, and thus elements that are the same as thosein the electro-optical device 100 of the foregoing first exemplaryembodiment will be given the same reference signs, and will not be givendetailed descriptions.

As illustrated in FIG. 14, the electro-optical device 300 of thisembodiment is a self-luminous display device in which an elementsubstrate 310, which includes a plurality of organic EL elements 30 andthe color filter 36, and a transmissive opposing substrate 40, aredisposed opposing each other, and are affixed to each other, interposingthe adhesive 41.

In the element substrate 310, each of the plurality of pixels P arrangedin the display region E1 includes the three sub pixels 18B, 18G, and18R. Each of the sub pixels 18B, 18G, and 18R has an organic EL element30, which includes the light-emission functional layer 32 formed betweenthe pixel electrode 31 and the opposing electrode 33. The light-emissionfunctional layer 32 and the opposing electrode 33 are formed across thedisplay region E1, and are sealed by the sealing layer 34.

The color filter 36 is formed on the sealing layer 34, in the displayregion E1. The color filter 36 is configured including the blue coloringlayers 36B, the green coloring layers 36G, and the red coloring layers36R, which are formed corresponding to the sub pixels 18B, 18G, and 18R.

The frame-shaped dummy CF region E4 is provided in a positionsurrounding the display region E1 on the sealing layer 34, and the greencoloring layer 36G and the blue coloring layer 36B are laminated in thedummy CF region E4 as the dummy CF. Furthermore, the similarlyframe-shaped light-shielding portion 36S (light-shielding region E3) isprovided surrounding the dummy CF region E4. The light-shielding portion36S is formed by laminating the coloring layers 36G, 36B, and 36R, whichhave different colors, in that order. The coloring layer 36G formed inthe light-shielding region E3 and the coloring layer 36G formed in thedummy CF region E4 are connected. Likewise, the coloring layer 36Bformed in the light-shielding region E3 and the coloring layer 36Bformed in the dummy CF region E4 are connected. Note that the averagethickness of the coloring layers 36G is approximately 1 μm, and theaverage thickness of the coloring layers 36B and the coloring layers 36Ris approximately 2 μm. The arrangement of the coloring layers 36B, 36G,and 36R in the pixels P is the same as in the above-described firstexemplary embodiment. In other words, the coloring layers 36B aredisposed on the sealing layer 34 independently for the sub pixels 18B,and the coloring layers 36R are disposed independently for the subpixels 18R. The green coloring layers 36G are disposed in stripe shapescorresponding to a plurality of sub pixels 18G arranged in the Ydirection.

In other words, a plurality of grooves 36 a, serving as protrusions andrecesses in a stripe pattern extending in the Y direction, are formed onthe surface of the color filter 36, in the element substrate 310, thatis affixed to the adhesive 41, the grooves 36 a being formed by thecolor filter 36. As illustrated in FIG. 15, the grooves 36 a are formedby the coloring layers 36G and the coloring layers 36B (the coloringlayers 36R) in the color filter 36 having different thicknesses.

The method of manufacturing the electro-optical device 300 omits theovercoat layer formation process (step S4) from the method ofmanufacturing the electro-optical device 100 of the foregoing firstexemplary embodiment; additionally, in the color filter formationprocess (step S3) of this embodiment, the coloring layers 36B, 36G, and36R are formed in the display region E1 corresponding to the sub pixels18B, 18G, and 18R, and the coloring layer 36G and coloring layer 36B areformed in a frame shape across the light-shielding region E3 and thedummy CF region E4. Furthermore, the light-shielding portion 36S isformed by laminating the coloring layer 36R in a frame shape on thecoloring layer 36B in the light-shielding region E3.

According to the electro-optical device 300 and the method ofmanufacturing the electro-optical device 300 of the third exemplaryembodiment, the following effects can be achieved.

(1) In the color filter 36 on the sealing layer 34, the coloring layers36B (coloring layers 36R) and the coloring layers 36G adjacent in the Xdirection serving as the second direction are given differentthicknesses, and the coloring layers 36B (the coloring layers 36R) aremade thinner than the coloring layers 36G, to form the grooves 36 aextending in the Y direction on the coloring layers 36G. In other words,the plurality of grooves 36 a, serving as protrusions and recesses in astripe pattern, are formed in the surface of the color filter 36 that isaffixed to the adhesive 41. In the process of affixing the elementsubstrate 310 and the opposing substrate 40, the adhesive 41 spreads outalong the grooves 36 a, which extend in the Y direction serving as thefirst direction and which have no level differences in their base parts,and it is therefore difficult for bubbles to form in the grooves 36 a.In other words, an electro-optical device 300 in which bubbles thataffect the display do not easily form, and a method of manufacturing theelectro-optical device 300, can be provided.

(2) In the dummy CF region E4 between the light-shielding region E3 andthe display region E1, the coloring layer 36B is formed in addition tothe coloring layer 36G as the dummy CF, and the height of the coloringlayer 36B on the sealing layer 34 is approximately 3 μm. Accordingly,level differences between the light-shielding portion 36S and the colorfilter 36 can be reduced, in the same manner as in the foregoing firstexemplary embodiment. As such, when affixing the element substrate 310and the opposing substrate 40 using the adhesive 41, a situation inwhich the substrates are affixed with bubbles present between thelight-shielding portion 36S, which is the highest part on the sealinglayer 34, and the color filter 36, can be suppressed.

The pixels P of the electro-optical device 300 according to the thirdexemplary embodiment described above are, as in the electro-opticaldevice 100 of the foregoing first exemplary embodiment, configured sothat the sub pixels 18B (the coloring layers 36B) and the sub pixels 18R(the coloring layers 36R) are arranged in the Y direction serving as thefirst direction, and the sub pixels 18G (the coloring layers 36G) arearranged in the X direction, serving as the second direction, withrespect to the sub pixels 18B (the coloring layers 36B) and the subpixels 18R (the coloring layers 36R). However, the configuration is notlimited thereto. For example, the configuration may be such that the subpixels 18B (the coloring layers 36B) and the sub pixels 18R (thecoloring layers 36R) are arranged in the X direction serving as thefirst direction, and the sub pixels 18G (the coloring layers 36G) arearranged in the Y direction, serving as the second direction, withrespect to the sub pixels 18B (the coloring layers 36B) and the subpixels 18R (the coloring layers 36R). In this case, the configuration issuch that the plurality of grooves 36 a, extending in the X directionand serving as protrusions and recesses in a stripe pattern, areprovided in the adhesive surface of the color filter 36. In other words,the direction in which the plurality of grooves 36 a, serving as theprotrusions and recesses in a stripe pattern, extend is not limited tothe Y direction, and may be the X direction instead.

Fourth Exemplary Embodiment

Electronic Apparatus

Next, a head-mounted display (HMD) serving as an example of anelectronic apparatus in which the electro-optical device of thisembodiment is applied in a display unit will be described with referenceto FIG. 16. FIG. 16 is a schematic diagram illustrating theconfiguration of the head-mounted display serving as the electronicapparatus.

A head-mounted display (HMD) 1000 includes a pair of optical units 1010Land 1010R for displaying information, corresponding to left and righteyes; a mounting part (not illustrated) for mounting the pair of opticalunits 1010L and 1010R on the head area of a user; a power source unitand a control unit (not shown), and the like. Here, the pair of opticalunits 1010L and 1010R are configured to be horizontally symmetrical, andthus the optical unit 1010R, configured for the right eye, will bedescribed as an example.

The optical unit 1010R includes a display unit 1001R, a frame-shapedcase part 1002, a focusing optical system 1003, and a light guide 1004bent into an L shape. A half mirror layer 1005 is provided in the lightguide 1004. In the optical unit 1010R, display light emitted from thedisplay unit 1001R is guided to the right eye by entering the lightguide 1004 through the focusing optical system 1003 and being reflectedby the half mirror layer 1005. The display light (image) projected ontothe half mirror layer 1005 is a virtual image. Accordingly, the user canvisually recognize both the display (the virtual image) by the displayunit 1001R and the outside world beyond the half mirror layer 1005. Inother words, the HMD 1000 is a transmissive (see-through)projection-type display device.

The light guide 1004 is configured by combining rod lenses, and forms arod integrator. The focusing optical system 1003 and the display unit1001R are arranged on the side of the light guide 1004 where lightenters, and the configuration is such that the display light focused bythe focusing optical system 1003 is received by the rod lenses.Additionally, the half mirror layer 1005 of the light guide 1004 has anangle that reflects light beams, which are focused by the focusingoptical system 1003 and then fully reflected and transmitted within therod lenses, toward the right eye.

The display unit 1001R can display a display signal transmitted from thecontrol unit in a display region as image information such as text, andvideo. The displayed image information is converted from an actual imageinto a virtual image by the focusing optical system 1003. Theself-luminous electro-optical device 100 of the above-described firstexemplary embodiment is applied in the display unit 1001R of thisembodiment. The frame-shaped case part 1002 is provided on the focusingoptical system 1003 side of the display unit 1001R, surrounding thedisplay region, so that light emitted from parts aside from the displayregion of the display unit 1001R is not focused by the focusing opticalsystem 1003 and therefore does not affect the display.

As described above, the optical unit 1010L for the left eye includes adisplay unit 1001L in which the electro-optical device 100 of theabove-described first exemplary embodiment is applied, and theconfiguration and functions of the optical unit 1010L are the same asthose of the optical unit 1010R for the right eye.

According to this embodiment, the self-luminous electro-optical device100 is applied in the display units 1001L and 1001R, and thus anillumination device such as a backlight is unnecessary, unlike withapplying non-luminous type liquid crystal devices. It is thereforepossible to provide a see-through type HMD 1000 which is both small andlight and which has an attractive display.

Note that the HMD 1000 in which the electro-optical device 100 of theabove-described first exemplary embodiment is applied is not limited toa configuration including the pair of optical units 1010L and 1010Rcorresponding to both eyes, and the configuration may instead includeonly the one optical unit 1010R, for example. The HMD is furthermore notlimited to a see-through type, and may instead be an immersive type inwhich the display is viewed in a state where the outside light isshielded.

Furthermore, the electro-optical device 200 of the above-describedsecond exemplary embodiment or the electro-optical device 300 of theabove-described third exemplary embodiment may be applied in the displayunits 1001L and 1001R.

Note that the invention is not limited to the exemplary embodimentdescribed above, and the exemplary embodiment described above can bevariously changed and modified. Modified examples are described below.

First Modified Example

The planar arrangement of the sub pixels 18B, 18G, and 18R in the pixelsP and the color filter 36 corresponding to these sub pixels is notlimited to the arrangement illustrated in FIG. 3, described in theforegoing first exemplary embodiment. FIG. 17 is a plan viewschematically illustrating the arrangement of sub pixels and a colorfilter according to a first modified example, and FIG. 18 is a schematiccross-sectional view illustrating the structure of the color filter andan overcoat layer, taken along line D-D□ from FIG. 17.

As illustrated in FIG. 17, in the first modified example, pixels Padjacent in the X direction are arranged so that the sub pixel 18G ofone of the pixels P is adjacent to the sub pixel 18G of the other pixelP in the X direction. The green coloring layers 36G are disposed instripe shapes corresponding to two columns□ worth of sub pixels 18Garranged in the Y direction. Accordingly, as illustrated in FIG. 18,forming the OC layer 50 through patterning to overlap with the coloringlayers 36B and the coloring layers 36R forms grooves 50 b, which spantwo pixels P adjacent in the X direction and which extend in the Ydirection. In other words, the grooves 50 b, which are wider than thegrooves 50 a according to the above-described first exemplaryembodiment, are formed. As such, during the process for affixing theelement substrate 10 to the opposing substrate 40, the adhesive 41spreads out along the wide grooves 50 b, and it is difficult for bubblesto form in the grooves 50 b. Note that as described in the foregoingfirst exemplary embodiment, the arrangement of the sub pixels 18B, 18G,and 18R in the pixels P is not limited to the arrangement describedhere, and a configuration is also possible in which the grooves 50 b ofthe above-described first modified example, obtained by patterning theOC layer 50, extend in the X direction.

Second Modified Example

The planar arrangement of the sub pixels 18B, 18G, and 18R in the pixelsP and the color filter 36 corresponding to these sub pixels is notlimited to the arrangement illustrated in FIG. 3, described in theforegoing first exemplary embodiment. FIG. 19 is a plan viewschematically illustrating the arrangement of sub pixels and a colorfilter according to a second modified example, and FIG. 20 is aschematic cross-sectional view illustrating the structure of the colorfilter and an overcoat layer, taken along line F-F□ from FIG. 19.

As illustrated in FIG. 19, in the second modified example, each pixel Pincludes two sub pixels 18B, one sub pixel 18G, and one sub pixel 18R,for example. In the pixel P, a sub pixel 18B and the sub pixel 18R arearranged in the Y direction. The sub pixel 18G is arranged adjacent to asub pixel 18B in the X direction. The other sub pixel 18B is arrangedadjacent to the sub pixel 18R in the X direction. The openings for thesub pixels 18B, 18G, and 18R are the same size, but as two sub pixels18B are used in each pixel P, the region from which blue light isemitted is substantially larger. The coloring layers 36B, 36G, and 36Rin the color filter 36 are arranged independently, corresponding to thisarrangement of the sub pixels 18B, 18G, and 18R. With this arrangementfor the coloring layers 36B, 36G, and 36R, in a case where each of thecoloring layers are given different thicknesses, complex leveldifferences will arise in the color filter 36 within the pixels P. Asillustrated in FIG. 20, in the second modified example, the first OClayer 51 is first formed to cover the color filter 36, after which thesecond OC layer 52 is formed on the first OC layer 51 through patterningin positions overlapping with the coloring layers 36B and the coloringlayers 36R, for example, when viewed in plan view, in the same manner asin the second exemplary embodiment. As a result, the plurality ofgrooves 52 a, serving as protrusions and recesses in a stripe patternextending in the Y direction, are formed on the color filter 36, inpositions overlapping with the coloring layers 36G and the coloringlayers 36B when viewed in plan view. Accordingly, in the process ofaffixing the element substrate and the opposing substrate 40 in thesecond modified example, the adhesive 41 spreads out along the pluralityof grooves 52 a, and it is difficult for bubbles to form in the grooves52 a. Note that the pixel P is not limited to including the three subpixels 18B, 18G, and 18R, and may, for example, include a sub pixel 18Yfor yellow (Y) in addition to blue (B), green (G), and red (R).Furthermore, even if the pixel P includes a total of four sub pixels 18,the direction in which the plurality of grooves 52 a formed on the colorfilter 36 extend is not limited to the Y direction, and may be the Xdirection instead, as described in the foregoing second exemplaryembodiment.

Third Modified Example

In the above-described second exemplary embodiment, the second OC layer52 is formed on the first OC layer 51 through patterning, in positionsoverlapping with the coloring layers 36B and the coloring layers 36Rarranged in the Y direction, when viewed in plan view. However, themethod of forming the second OC layer 52 is not limited thereto. Becausethe first OC layer 51 is formed covering the color filter 36, it isdifficult for differences in the thicknesses of the coloring layers 36B,36G, and 36R in the color filter 36 to have an effect on the affixingprocess. Thus, the direction in which the second OC layer 52 is formedas stripes is not limited to the Y direction, and may be the X directioninstead. Additionally, the stripe-shaped second OC layer 52 is notlimited to being formed for each of the pixels P, and the stripe-shapedsecond OC layer 52 having desired widths with desired gaps may be formedon the first OC layer 51.

Fourth Modified Example

The electronic apparatus in which the electro-optical devices of theabove-described embodiments is applied is not limited to thehead-mounted display (HMD) of the above-described fourth exemplaryembodiment. For example, the electro-optical device can be favorablyused in the display unit of an electronic viewfinder in a digital cameraor the like, a head-up display, a mobile information terminal, and thelike.

The following describes details that can be derived from theembodiments.

An electro-optical device according to an aspect of the inventionincludes, a first substrate including a plurality of light-emittingelements and a color filter provided corresponding to the plurality oflight-emitting elements, and a second substrate being a transmissivesubstrate and disposed facing the first substrate with an adhesiveprovided between the first substrate and the second substrate, whereinan adhesive surface of the color filter of the first substrate isprovided with protrusions and recesses in a stripe pattern.

According to the configuration of this aspect, when affixing the firstsubstrate and the second substrate, the adhesive spreads out along theprotrusions and recesses in a stripe pattern at the adhesive surface ofthe color filter. Accordingly, even if the coloring layers constitutingthe color filter have, for example, different thicknesses from color tocolor and complex level differences arise as a result, problems such asunevenness in the application of the adhesive, bubbles forming in theadhesive, and the like can be reduced. In other words, anelectro-optical device in which bubbles that affect the display do noteasily form can be provided.

Preferably, the above-described electro-optical device further includingan overcoat layer provided on the color filter, the overcoat layer beinga transmissive layer, and the overcoat layer is provided withprotrusions and recesses in a stripe pattern.

According to this configuration, providing the overcoat layer on thecolor filter makes it difficult for the device to be affected by leveldifferences produced by differences in the thicknesses of the coloringlayers. In other words, an electro-optical device in which bubbles thataffect the display form even less easily can be provided.

Preferably, in the above-described electro-optical device, the colorfilter includes coloring layers of at least three colors, and theovercoat layer covers a coloring layer arranged in a first directionamong the coloring layers of at least three colors.

According to this configuration, the protrusions and recesses in astripe pattern can be realized by the overcoat layer in each pixelprovided with the coloring layers of at least three colors.

Additionally, in the above-described electro-optical device, thecoloring layer arranged in the first direction may include coloringlayers having different thicknesses.

According to this configuration, the coloring layers of differentthicknesses that are arranged in the first direction are covered by theovercoat layer, and as a result, the coloring layers having differentthicknesses has no effect when adhering the first substrate and thesecond substrate.

Additionally, in the above-described electro-optical device, a coloringlayer arranged in a second direction intersecting with the firstdirection may have a thickness different from that of the coloring layerarranged in the first direction.

According to this configuration, the coloring layer arranged in thesecond direction has a thickness different from that of the coloringlayer arranged in the first direction, and thus protrusions and recessesin a stripe pattern extending in the first direction can be configuredat the adhesive surface of the color filter.

Preferably, in the above-described electro-optical device, the overcoatlayer includes a first overcoat layer covering the color filter, and asecond overcoat layer extending in a first direction on the firstovercoat layer, and the protrusions and recesses in a stripe pattern areformed by the first overcoat layer and the second overcoat layer.

According to this configuration, the color filter is covered by thefirst overcoat layer, and thus even if the coloring layers constitutingthe color filter have, for example, different thicknesses from color tocolor, the first substrate and the second substrate can be affixed toeach other, interposing the adhesive without being affected by leveldifferences between the coloring layers.

Additionally, in the above-described electro-optical device, the colorfilter may include coloring layers of at least three colors, and theprotrusions and recesses in a stripe pattern may be formed by makingthicknesses of two coloring layers of different colors among thecoloring layers of at least three colors, different from each other.

According to this configuration, the protrusions and recesses in astripe pattern are provided by giving two coloring layers of differentcolors different thicknesses at the adhesive surface of the colorfilter. Accordingly, when affixing the first substrate and the secondsubstrate using the adhesive, the adhesive spreads out along theprotrusions and recesses, which makes it possible to affix the firstsubstrate and the second substrate in a state where bubbles do noteasily form.

Preferably, in the above-described electro-optical device, the colorfilter includes coloring layers of at least three colors, and alight-shielding portion formed by laminating the coloring layers of atleast three colors is provided in a position surrounding alight-emitting region, the light-emitting region being a region in whichthe plurality of light-emitting elements are disposed.

According to this configuration, the light-shielding portion formed bylaminating the coloring layers of at least three colors is provided in aposition surrounding the light-emitting region, and thus light leakingfrom the light-emitting region can be shielded by the light-shieldingportion, making it possible to provide an electro-optical device capableof an attractive display.

A method of manufacturing an electro-optical device according to anaspect of the invention is a method of manufacturing an electro-opticaldevice including a plurality of light-emitting elements and a colorfilter, the method including, forming a sealing layer sealing theplurality of light-emitting elements across a light-emitting region of afirst substrate, the light-emitting region being a region in which theplurality of light-emitting elements are disposed, forming a colorfilter by forming coloring layers of at least three colors on thesealing layer, the coloring layers corresponding to the plurality oflight-emitting elements, forming an overcoat layer covering a coloringlayer arranged in a first direction among the coloring layers of atleast three colors, the overcoat layer being a transmissive layer, andaffixing the first substrate to a second substrate using an adhesive,the first substrate being a substrate on which the overcoat layer isformed and the second substrate being a transmissive substrate.

According to this method, when forming the overcoat layer, theprotrusions and recesses in a stripe pattern extending in the firstdirection can be formed at the adhesive surface of the color filter. Assuch, during the affixing, the adhesive can spread out along theprotrusions and recesses in a stripe pattern, and thus the firstsubstrate and the second substrate can be affixed to each other, withoutbeing affected by level differences caused by the thicknesses of thecoloring layers in the color filter, while reducing problems such asunevenness in the application of the adhesive and bubbles forming in theadhesive. In other words, a method of manufacturing an electro-opticaldevice in which bubbles that affect the display do not easily form canbe provided.

A method of manufacturing an electro-optical device according to anotheraspect of the invention is a method of manufacturing an electro-opticaldevice including a plurality of light-emitting elements and a colorfilter, the method including, forming a sealing layer sealing theplurality of light-emitting elements across a light-emitting region of afirst substrate, the light-emitting region being a region in which theplurality of light-emitting elements are disposed, forming a colorfilter by forming coloring layers of at least three colors on thesealing layer, the coloring layers corresponding to the plurality oflight-emitting elements, forming a first overcoat layer covering thecolor filter, with the first overcoat layer being a transmissive layer,and forming a second overcoat layer extending in the first direction onthe first overcoat layer, with the second overcoat layer being atransmissive layer, and affixing the first substrate to a secondsubstrate using an adhesive, the first substrate being a substrateprovided with the first overcoat layer and the second overcoat layer thesecond substrate being a transmissive substrate.

According to the method of this other aspect, during the forming of theovercoat layer, the first overcoat layer is formed covering the colorfilter, and the second overcoat layer is furthermore formed on the firstovercoat layer. Accordingly, the protrusions and recesses in a stripepattern can be formed at the adhesive surface of the color filter by thesecond overcoat layer extending in the first direction. As such, duringthe affixing, the adhesive can spread out along the protrusions andrecesses in a stripe pattern, and thus the first substrate and thesecond substrate can be affixed to each other, without being affected bylevel differences caused by the thicknesses of the coloring layers inthe color filter, while reducing problems such as unevenness in theapplication of the adhesive and bubbles forming in the adhesive. Inother words, a method of manufacturing an electro-optical device inwhich bubbles that affect the display do not easily form can beprovided.

A method of manufacturing an electro-optical device according to anotheraspect of the invention is a method of manufacturing an electro-opticaldevice including a plurality of light-emitting elements and a colorfilter, the method including, forming a sealing layer sealing theplurality of light-emitting elements across a light-emitting region of afirst substrate, the light-emitting region being a region in which theplurality of light-emitting elements are disposed, forming a colorfilter by forming coloring layers of at least three colors on thesealing layer, the coloring layers corresponding to the plurality oflight-emitting elements, and affixing the first substrate to a secondsubstrate using an adhesive, the first substrate being a substrate onwhich the color filter is formed, with the second substrate being atransmissive substrate, wherein in the forming of the color filter, afirst coloring layer and a second coloring layer among the coloringlayers of at least three colors are formed to be arranged in a firstdirection, and a third coloring layer having a different thickness fromthe first coloring layer and the second coloring layer is formed andarranged adjacent to the first coloring layer and the second coloringlayer in a second direction intersecting with the first direction.

According to the method of this other aspect, during the forming of thecolor filter, the third coloring layer is formed adjacent in the seconddirection to, and having a different thickness with respect to the firstcoloring layer and the second coloring layer, which are arranged in thefirst direction. As such, the protrusions and recesses in a stripepattern extending in the first direction are formed on the color filter.As such, during the affixing, the adhesive can spread out along theprotrusions and recesses in a stripe pattern, and thus the firstsubstrate and the second substrate can be affixed to each other, withoutbeing affected by level differences caused by the thicknesses of thecoloring layers in the color filter, while reducing problems such asunevenness in the application of the adhesive and bubbles forming in theadhesive. In other words, a method of manufacturing an electro-opticaldevice in which bubbles that affect the display do not easily form canbe provided.

Preferably, in the above-described method of manufacturing anelectro-optical device, in the forming of the color filter, alight-shielding portion is formed by laminating the coloring layers ofat least three colors in a position surrounding the light-emittingregion.

According to this method, the light-shielding portion formed by layeringthe coloring layers of at least three colors is formed in a positionsurrounding the light-emitting region, and thus light leaking from thelight-emitting region can be shielded by the light-shielding portion,making it possible to manufacture an electro-optical device capable ofan attractive display.

Preferably, in the above-described method of manufacturing anelectro-optical device, in the forming of the color filter, alight-shielding portion is formed by layering the coloring layers of atleast three colors in a position surrounding the light-emitting regionand in the forming of the overcoat layer, the overcoat layer is formedon an inner side of the light-shielding portion.

According to this method, a level difference arising between thelight-shielding portion and the color filter provided in thelight-emitting region can be reduced by the overcoat layer. Accordingly,during the affixing, the adhesive can easily pass over thelight-shielding portion and spread out, which makes it possible toreduce situations where bubbles form in the adhesive at the leveldifference between the light-shielding portion and the color filter.

An electronic apparatus according to an aspect of the inventionincluding the above-described electro-optical device.

According to the configuration of this aspect, a self-luminouselectro-optical device in which it is at least difficult for bubbles toarise in the light-emitting region is included, and thus an electronicapparatus capable of an attractive display can be provided.

The entire disclosure of Japanese Patent Application No. 2018-036220,filed Mar. 1, 2018 is expressly incorporated by reference herein.

What is claimed is:
 1. An electro-optical device comprising: a firstsubstrate; a second substrate; a color filter disposed in a layerbetween the first substrate and the second substrate; an adhesivedisposed in a layer between the color filter and the second substrate; afirst overcoat layer disposed in a layer between the adhesive and thecolor filter; and a second overcoat layer that is disposed in the layerbetween the adhesive and the color filter and that is disposed along thefirst overcoat layer.
 2. The electro-optical device according to claim1, wherein the adhesive includes: a first surface contacted to thesecond substrate; a second surface contacted to the first overcoatlayer; and a third surface contacted to the color filter, and a firstdistance between the first surface and the second surface in a thicknessdirection of the first substrate is different from a second distancebetween the first surface and the third surface in the thicknessdirection.
 3. The electro-optical device according to claim 2, whereinthe adhesive includes a fourth surface in contact with the secondovercoat layer, and a third distance between the first surface and thefourth surface in the thickness direction is same as the first distance.4. The electro-optical device according to claim 3, wherein the seconddistance is longer than the first distance and the third distance. 5.The electro-optical device according to claim 3, wherein protrusions andrecesses are formed in a striped manner by the second surface, the thirdsurface, and the fourth surface.
 6. The electro-optical device accordingto claim 1, wherein the color filter includes coloring layers of atleast three colors, and a light-shielding portion formed by laminatingthe coloring layers of at least three colors is disposed in a positionsurrounding a light-emitting region in which a plurality oflight-emitting elements are disposed.
 7. The electro-optical deviceaccording to claim 1, wherein the color filter includes coloring layersof at least three colors, the first overcoat layer and the secondovercoat layer cover coloring layers arranged in a first direction amongthe coloring layers of at least three colors, and the coloring layersarranged in the first direction are coloring layers having differentthicknesses.
 8. An electronic apparatus comprising the electro-opticaldevice according to claim 1.